发明名称 |
Light emitting element and method of making same |
摘要 |
A light emitting element that includes a Ga2O3 substrate; an AlxGa1-xN buffer layer (0≦×≦1) formed on the Ga2O3 substrate; an n-GaN layer formed on the AlxGa1-xN buffer layer; an p-GaN layer formed on a portion of the n-GaN layer; an n-electrode formed on a portion of the n-GaN layer; and an p-electrode formed on the p-GaN layer. |
申请公布号 |
US9117974(B2) |
申请公布日期 |
2015.08.25 |
申请号 |
US201414317089 |
申请日期 |
2014.06.27 |
申请人 |
KOHA CO., LTD. |
发明人 |
Ichinose Noboru;Shimamura Kiyoshi;Kaneko Yukio;Garcia Villora Encarnacion Antonia;Aoki Kazuo |
分类号 |
H01L33/42;C30B15/00;C30B15/34;C30B29/16;H01L21/02;H01L33/00;H01L33/32;H01L33/62 |
主分类号 |
H01L33/42 |
代理机构 |
Scully, Scott, Murphy & Presser, P.C. |
代理人 |
Scully, Scott, Murphy & Presser, P.C. |
主权项 |
1. A flip-chip type light emitting element, comprising:
a gallium oxide substrate; an AlxGa1-xN buffer layer (0≦x≦1) formed on the gallium oxide substrate; an n-GaN layer formed on the AlxGa1-xN buffer layer; an p-GaN layer formed on first a portion of the n-GaN layer; an n-electrode formed on a second portion of the n-GaN layer; and an p-electrode formed on the p-GaN layer. |
地址 |
Tokyo JP |