CONNECTION PLATE-MOUNTING SUBSTRATE FOR CAPACITOR

摘要

PROBLEM TO BE SOLVED: To reduce wiring inductance without changing conventional layout.SOLUTION: A connection plate-mounting substrate is configured by integrally laminating a substrate front-side pattern of a conductive metal, a substrate insulation layer and a substrate rear-side pattern of a conductive metal. The substrate front-side pattern includes: a P-side plate; a P-terminal front side integrated with the P-side plate; and an N terminal front side separated from the P terminal. The substrate rear-side pattern includes: an N-side plate; an N terminal rear side integrated with the N-side plate; and a P terminal rear side separated from the N terminal. One or more capacitor elements are connected and housed within a case, and the inside of the case is filled with a resin. A substrate terminal part is configured by being folded in a folding portion in an inverter direction for connecting with an inverter installed together, and the P terminal and the N terminal of the substrate terminal part are configured by integrally laminating the conductive metals on both the front and rear sides of the substrate insulation layer, respectively.