METHOD FOR PRODUCING CONNECTION STRUCTURE, AND CIRCUIT CONNECTING MATERIAL

摘要

The present invention provides a method for manufacturing a connection structure capable of maintaining a life and a low-temperature compression, and a circuit connection material. The invention comprises an arrangement process for arranging a first circuit member and a second circuit member by interposing a circuit connection material; and a compression process for obtaining a connection structure by thermally compressing the first circuit member and the second circuit member at a predetermined temperature wherein the circuit connection material comprises: a radically polymerizable compound; an organic peroxide having a one-minute half-life temperature that is higher than the predetermined temperature and not more than 20°C above zero; a secondary thiol compound; and conductive particles.