发明名称 |
GRINDING AND POLISHING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a grinding and polishing device which adjusts a chuck table at a desired tilt mutually between grinding and polishing.SOLUTION: A grinding and polishing device includes a chuck table 43 which rotatably holds a plate-like workpiece W and can move to a grinding area where grinding processing is performed and a polishing area where polishing processing is performed. When the chuck table is moved to the grinding area, the chuck table is tilted so that a surface of the plate-like workpiece and a grinding surface of grinding means 51 become parallel. When the chuck table is moved to the polishing area, the chuck table is tilted so that the surface of the plate-like workpiece is pressed at a uniform pressure by polishing means 71. |
申请公布号 |
JP2015150642(A) |
申请公布日期 |
2015.08.24 |
申请号 |
JP20140026192 |
申请日期 |
2014.02.14 |
申请人 |
DISCO ABRASIVE SYST LTD |
发明人 |
INOUE YUKI;SUZUKI TAKAMASA |
分类号 |
B24B7/00;B23Q3/08;B24B7/04;B24B37/34;B24B41/06;B24B49/16;H01L21/304 |
主分类号 |
B24B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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