| 摘要 |
The present invention relates to a method for installing an electronic component (180) on a component carrier (175). The method for installing an electronic component (180) on a component carrier (175) comprises: (a) a step of using a first camera (120) to optically detect a first image from a first surface of a component (180) from which a first structural feature (185) of the component (180) can be detected; (b) a step of using a second camera (160) to optically detect a second image from a second surface of the component (180) from which a second structural feature (186) of the component (180) can be detected in a condition where the first surface and the second surface oppose each other, and the second structural feature (186) is connected to a predetermined location on a component carrier (175); (c) a step of aligning a center of the first structural feature (185) to a prescribed location on the component carrier (175) and offsetting the second structural feature (186) from the predetermined location accordingly by orienting the electronic component (180); and (d) a step of installing the electronic component (180) on the component carrier (175) while the center of the first structural feature (185) is aligned with the component carrier (175), and the second structural feature (186) is offset from the predetermined location. Additionally, the present invention relates to a method for inspecting functionality of an optoelectronic component before mounting the optoelectronic component on a component carrier, and an automatic mounting device for installing an optically measured electronic component. |
