| 摘要 |
An air-cooled type resin container cooling device in a resin application apparatus is disclosed. The disclosed resin container cooling device comprises a cooling case for covering a resin container in a resin application apparatus, forming a cooling chamber to surround the resin container, and being equipped with an insertion hole for supplying cooling air to one side and a discharging hole for discharging the cooling air, wherein the cooling air inserted through the insertion hole to the cooling chamber is configured to indirectly cool the resin stored in the resin container by being contacted with the outer surface of the resin container while flowing in the cooling chamber. |
