SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE AND ADHESIVE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a method of fully and effectively manufacturing a semiconductor device having excellent connection reliability; and provide an adhesive composition used for the method; and provide the semiconductor device.SOLUTION: An adhesive composition which is used for manufacturing of a semiconductor device including a semiconductor chip 10 and contains (A) epoxy resin, (B) a curing agent, (C) an inorganic filler and (D) an organic solvent. Shear viscosity of the adhesive composition at 60°C is 1000-100000 Pa s and the shear viscosity at 60°C is defined as a value measured in the process of (1) forming an adhesive layer composed of the adhesive composition on a base material film and applying heat to the adhesive layer at 100°C for 10 minutes to dehydrate the adhesive layer, and (2) raising a temperature of the adhesive layer at a rate of temperature rise of 10°C/min from 30°C to 150°C.