| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring mounting structure, a liquid injection head and a liquid injection device capable of arranging wiring at a high density, reducing a cost and materializing miniaturization.SOLUTION: A wiring mounting structure includes: a first substrate having a first wiring terminal array 335A and a second wiring terminal array 336A which are arranged side by side with a first pitch; and a second substrate having a connection terminal array 91A in which connection terminals are arranged side by side with a second pitch broader than the first pitch. Therein, a plurality of inclination surface wirings 333 of which one edge is electrically connected with a first wiring terminal 335 or a second wiring terminal 336 and the other edge is electrically connected with a connective terminal of the second substrate are arranged side by side, the first wiring terminal 335 and the second wiring terminal 336 are arranged with an interval broader than the second pitch, the first wiring terminal array 335A and the second wiring terminal array 336A are arranged so as to be restored within the length l1 of the connection terminal array 91A and an inclination surface wiring 33 is provided on a slant 321 corresponding to the broad interval.</p> |
