| 摘要 |
An electronic-circuit assembly according to the present invention comprises a first substrate on the upper surface of which a plurality of ele ctrodes are provided. A second substrate is placed on the first substrate. The secon d substrate comprises a plurality of through-holes on the positions opposing t o the plurality of terminals on the first substrate, respectively. The plurality o f terminals on the first substrate are connected to the plurality of through-h oles on the second substrate via a plurality of connecting members, respectively. A plate is placed on the upper surface of the second substrate. A plurality of pins which are provided on the under surface of the plate are inserted into the plurali ty of through-holes on the second substrate, respectively. |
