| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the accuracy of determining the result of inspection of a solder-bonded state in a surface-mounting line.SOLUTION: Provided is a quality control system in a surface-mounting line for executing a solder printing step of printing solder to a printed circuit board by a solder printing device, a mounting step of disposing an electronic component on the printed circuit board by a mounter, and a reflow step of solder-bonding the electronic component by a reflow furnace, the quality control system comprising: a terminal detection device for generating, after the mounting step, terminal information that is the information relating to the positions of terminals of the electronic component disposed on the printed circuit board; and a mounting inspection device for specifying, on the basis of the terminal information after the reflow step, the positions of the terminals that the electronic component has and inspecting the solder-bonded state of the terminals and the printed circuit board.</p> |
