| 摘要 |
Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight: (A) 40 to 80 parts of allyl modified polybenzoxazine resin; (B) 10 to 20 parts of hydrcarbon resin; (C) 10 to 40 parts of allyl modified polyphenylene ether resin; (D) 0.01 to 3 parts of initiating agent; (E) 10 to 100 parts of a filling material; and (F) 0 to 80 parts of phosphoric fire retardant. The prepreg and the laminate prepared by using the halogen-free resin composition has a low dielectric coefficient and a low dielectric loss dissipation tangent, a higher separation strength, a high glass-transition temperature, excellent heat resistance, and good flame retardation effect. |
