PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, AND METHOD FOR FORMING RESIST PATTERN

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent overhang releasing property and plating resistance.SOLUTION: The photosensitive resin composition comprises: (a) an alkali-soluble polymer by 20 mass% to 90 mass%; (b) an addition polymerizable monomer having at least one polymerizable ethylenically unsaturated bond in the molecule, by 5 mass% to 75 mass%; and (c) a photopolymerization initiator by 0.01 mass% to 30 mass%. When the photosensitive resin composition is laminated into a thickness of 38 μm on a substrate, exposed and developed to obtain a cured resist and further the cured resist is immersed in a 4 wt.% sodium hydroxide aqueous solution at 50°C and peeled from the substrate, the cured resist shows a swelling rate of 165% or more.