| 发明名称 |
COVER MATERIAL FOR HERMETIC SEALING AND PACKAGE FOR CONTAINING ELECTRONIC COMPONENT |
| 摘要 |
This cover material for hermetic sealing is a cover material for hermetic sealing employed for a package for containing an electronic component. The cover material 1 for hermetic sealing is constituted of a clad material including a base material layer made of an Ni—Cr—Fe alloy containing Ni, Cr and Fe or an Ni—Cr—Co—Fe alloy containing Ni, Cr, Co and Fe, and a surface layer bonded to one surface of the base material layer on a side of an electronic component containing member and made of Ni or an Ni alloy. |
| 申请公布号 |
US2015232244(A1) |
申请公布日期 |
2015.08.20 |
| 申请号 |
US201314428054 |
申请日期 |
2013.11.08 |
| 申请人 |
NEOMAX MATERIALS Co., Ltd. ;HITACHI METALS, LTD. |
发明人 |
Yokota Masayuki;Yamamoto Masaharu |
| 分类号 |
B65D65/02;B32B15/01;B65D85/00;B65D25/10;B65D65/38 |
主分类号 |
B65D65/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cover material for hermetic sealing employed for a package for containing an electronic component including an electronic component containing member for containing an electronic component, constituted of a clad material comprising:
a base material layer made of an Ni—Cr—Fe alloy containing Ni, Cr and Fe or an Ni—Cr—Co—Fe alloy containing Ni, Cr, Co and Fe; and a surface layer at least bonded to one surface of the base material layer on a side of the electronic component containing member and made of Ni or an Ni alloy. |
| 地址 |
Suita-shi, Osaka JP |
