SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A semiconductor device permitting the reduction of cost is disclosed. In a semiconductor package wherein electrode pads of a semiconductor chip and corresponding inner leads are electrically coupled with each other through a plurality of bonding wires, sensing wires (second and fourth bonding wires) are made thinner than other bonding wires (first and third bonding wires) coupled to inner leads same as those with the sensing wires coupled thereto, thereby reducing the cost of gold wires to attain the reduction in cost of the semiconductor package.

主权项

1. A semiconductor device, comprising:
a chip mounting portion; a semiconductor chip mounted over the chip mounting portion, the semiconductor chip including a plurality of pads; a plurality of leads; a plurality of wires electrically connecting the plurality of pads with the plurality of leads, respectively; and a resin sealing body sealing the semiconductor chip and the plurality of wires, wherein the plurality of leads include:
a first lead, anda second lead, the plurality of wires include:
a first wire electrically connected with the first lead,a second wire electrically connected with the second lead, anda third wire electrically connected with the second lead, a diameter of each of the second and third wires is larger than a diameter of the first wire, and the number of wires electrically connected with the second lead is greater than the number of wires electrically connected with the first lead.