MOISTURE-CURING HOT-MELT ADHESIVE COMPOUND CONTAINING POLYALDIMINE

摘要

Described is moisture-reactive hot-melt adhesive compounds, including at least one polyurethane polymer P which is solid at room temperature and which has isocyanate groups, at least one polyaldimine ALD of the formula (Ia) or (Ib), and at least one acid K in the form of an organic monocarbon acid, or dicarbon acid, or an organic monosulphonic acid, or disulphonic acid, or a compound which can be hydrolyzed to give one of these acids. These hot-melt adhesive compounds cure without bubbles and exhibit exceptionally quick crosslinking speed and good strength after crosslinking.

主权项

1. A moisture-reactive hotmelt adhesive composition comprising:
a) at least one polyurethane polymer P which is solid at room temperature and contains isocyanate groups, b) at least one polyaldimine ALD of the formula (I a) or (I b), c) at least one acid K in the form of an organic monocarboxylic acid or dicarboxylic acid or of an organic monosulfonic acid or disulfonic acid, or of a compound which can be hydrolyzed to one of these acids; wherein in formula (I a) or (I b) X is the organic radical of an n-functional primary polyamine following removal of n aliphatic primary amino groups, this organic radical containing no moieties which in the absence of water are reactive with isocyanate groups, no secondary amino groups, no urea groups, and no other groups with active hydrogen; n is 2 or 3 or 4; Y1 and Y2 either independently of one another are each a monovalent hydrocarbon radical having 1 to 12 C atoms, or together are a divalent hydrocarbon radical having 4 to 20 C atoms which is part of an optionally substituted carbocyclic ring having 5 to 8 C atoms; Y3 is a monovalent hydrocarbon radical which contains at least one heteroatom in the form of ether, carbonyl or ester groups; Y4 alternativelyis a substituted or unsubstituted aryl or heteroaryl group which has a ring size of between 5 and 8 atoms
or is where R2 is a hydrogen atom or is an alkoxy group, or is a substituted or unsubstituted alkenyl or arylalkenyl group having at least 6 C atoms, wherein the moisture-reactive hotmelt adhesive composition is solid at room temperature.