| 摘要 |
The present disclosure relates to a solid-state imaging device which enables downsizing of a package, an electronic apparatus, and a solid-state imaging device manufacturing method. A pattern group is formed on a glass substrate of a solid-state imaging device. In the pattern group, outer patterns each formed to correspond to a wiring pattern on a package are disposed on the outer side of the glass substrate, and inner patterns each formed to correspond to an image sensor are disposed on the inner side of the glass substrate. The same number of outer patterns and inner patterns are formed so as to be paired, and the patterns to be paired from among the outer patterns and the inner patterns are connected by the wiring pattern. The present disclosure is applicable, for example, to a CMOS solid-state imaging device used as an imaging device. |
