| 发明名称 |
Methods for Stud Bump Formation and Apparatus for Performing the Same |
| 摘要 |
An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump. |
| 申请公布号 |
US2015235975(A1) |
申请公布日期 |
2015.08.20 |
| 申请号 |
US201514703260 |
申请日期 |
2015.05.04 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Hwang Chien Ling;Lin Yeong-Jyh;Hsiao Yi-Li;Cheng Ming-Da;Tsai Tsai-Tsung;Liu Chung-Shi;Lii Mirng-Ji;Yu Chen-Hua |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
supplying a wire from a spool; forming a notch in the wire; bonding using a capillary the wire onto an electrical connector and forming a stud bump on the electrical connector, with the notch formed between the spool and the capillary; and pulling the wire to break the wire from the stud bump at the notch. |
| 地址 |
Hsin-Chu TW |
