| 发明名称 |
HIGH FREQUENCY MODULE |
| 摘要 |
A high frequency module includes a module board, a connection member, and test terminals. The module board has a first surface on which a transmit antenna and a receive antenna are provided and a second surface on which a signal processing IC is provided, the second surface of the module board being the opposite side of the first surface. The connection member contains wiring for connecting the signal processing IC disposed on the second surface of the module board with another board. The test terminals are connected with the signal processing IC disposed on the second surface of the module board and arranged on the first surface of the module board. |
| 申请公布号 |
US2015234003(A1) |
申请公布日期 |
2015.08.20 |
| 申请号 |
US201514702633 |
申请日期 |
2015.05.01 |
| 申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
SHIOZAKI RYOSUKE;KASHINO YUICHI;FUJITA SUGURU |
| 分类号 |
G01R31/28 |
主分类号 |
G01R31/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A high frequency module comprising:
a module board; antennas disposed on a first surface of the module board; signal processing circuits disposed on a second surface of the module board which is an opposite side of the first surface of the module board; a connection member connected with the module board and another board and containing wiring for the signal processing circuits; and one or more test terminals connected with the signal processing circuits and disposed on the first surface of the module board. |
| 地址 |
Osaka JP |
