| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an insulating circuit board capable of suppressing a reduction in thermal cycle life, a base for a power module, and a method for manufacturing the same. <P>SOLUTION: An insulating circuit board 4 comprises a ceramic insulating plate 5 and a pure aluminum circuit board 6 which is brazed to one surface of the insulating plate 5 with a brazing filler material containing Si. A remaining brazing filler material layer 12 containing Si particles exists between the insulating plate 5 and the circuit board 6. A thickness of the remaining brazing filler material layer 12 is 3μm or less, and an area ratio of the Si particles contained in the remaining brazing filler material layer 12 is 20% or less. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
