发明名称 |
DOUBLE-SIDED METALLIC LAMINATE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
<p>The present invention relates to a double-sided metallic laminate for a printed circuit board and a method for manufacturing the same. The double-sided metallic laminate which comprises a metallic layer at one side, a resin layer of a polyimide for improving adhesion with a metal, a resin layer of a low expansion polyimide having a thermal expansion coefficient of 5x10-6 to 2.5x10-5/° C. and a metallic layer at the other side, has excellent flexibility and thermal resistance, can prevent curl and is securely laminated, particularly without the use of an adhesive. Therefore, it is suitable for a printed circuit board of a small size electric appliance.</p> |
申请公布号 |
EP1606108(B1) |
申请公布日期 |
2015.08.19 |
申请号 |
EP20040723419 |
申请日期 |
2004.03.25 |
申请人 |
LG CHEM LTD. |
发明人 |
PARK, SOON-YONG;KYUNG, YOU-JIN;SONG, HEON-SIK;AHN, BYEONG-IN;KO, JOO-EUN;PARK, YONG-JUN;JANG, SE-MYUNG |
分类号 |
B32B15/08;H05K1/03 |
主分类号 |
B32B15/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|