| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which permits microfabrication owing to a superior tack-free property of a coating film after drying and photosensitivity, which gives a cured film with excellent flexibility, flame retardancy and electrical insulation reliability, and which causes a small warpage to a substrate after curing, and to provide a resin film, an insulating film and a printed wiring board with an insulting film. <P>SOLUTION: A photosensitive resin composition includes at least: (A) a binder polymer; (B) cross-linked polymer particles, (C) a thermosetting resin; (D) a photopolymerization initiator; and (E) a phosphorus compound including a radical polymerizable group in a molecule. <P>COPYRIGHT: (C)2013,JPO&INPIT |
