| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting device which allows a resin part of a package to be bonded to a lead frame more securely and thereby achieving excellent peeling resistance. <P>SOLUTION: A light emitting device includes: a package including a resin part which is formed including a resin and a lead frame disposed in the resin part; and a light emitting element disposed on an element placement surface of the package. Further, the light emitting device has a placement part where the lead frame is exposed from the resin part on the element placement surface, and the light emitting element is placed on the placement part. In a manufacturing method of the light emitting device, a protruding part is formed in the lead frame using the placement part as an upper surface by etching the surrounding area of the placement part. Further, the resin part enclosing the protruding part is formed by flowing the resin into the surrounding area of the protruding part. <P>COPYRIGHT: (C)2012,JPO&INPIT |
