Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates

摘要

In some embodiments an Integrated Circuit package includes a plurality of system functional pins, at least one system functional pin depopulation zone, and at least one non-system functional pin located in the at least one functional pin depopulation zone. Other embodiments are described and claimed.

主权项

1. A Central Processing Unit (CPU), comprising:
a plurality of system functional pins; at least one system functional pin depopulation zone; and at least one non-system functional pin located in the at least one functional pin depopulation zone, wherein the at least one non-system functional pin sends test signals, and wherein a stacked-socket interposer probe head assembly is to receive a signal from the at least one non-system functional pin, and pass a system functional signals from an Integrated Circuit package to a socket.