发明名称 |
Power semiconductor package with non-contiguous, multi-section conductive carrier |
摘要 |
In one implementation, a power semiconductor package includes a non-contiguous, multi-section conductive carrier. A control transistor with a control transistor terminal is coupled to a first section of the multi-section conductive carrier, while a sync transistor with a sync transistor terminal is coupled to a second section of the multi-section conductive carrier. The first and second sections of the multi-section conductive carrier sink heat generated by the control and sync transistors. The first and second sections of the multi-section conductive carrier are electrically connected only through a mounting surface attached to the power semiconductor package. Another implementation of the power semiconductor package includes a driver IC coupled to a third section of the multi-section conductive carrier. A method for fabricating the power semiconductor package is also disclosed. The power semiconductor package according to the present disclosure results in effective thermal protection, current carrying capability, and a relatively small size. |
申请公布号 |
US9111776(B2) |
申请公布日期 |
2015.08.18 |
申请号 |
US201414488747 |
申请日期 |
2014.09.17 |
申请人 |
International Rectifier Corporation |
发明人 |
Cho Eung San |
分类号 |
H01L29/76;H01L25/07;H01L23/00;H01L23/31;H01L21/48;H01L21/56;H01L25/11;H01L25/16;H01L23/492;H01L23/495 |
主分类号 |
H01L29/76 |
代理机构 |
Farjami & Farjami LLP |
代理人 |
Farjami & Farjami LLP |
主权项 |
1. A power semiconductor package comprising:
a non-contiguous, multi-section conductive carrier; a control transistor with a control transistor terminal coupled to a first section of said multi-section conductive carrier; a sync transistor with a sync transistor terminal coupled to a second section of said multi-section conductive carrier; said first and second sections of said multi-section conductive carrier sinking heat generated by said control and sync transistors; said first and second sections of said multi-section conductive carrier being electrically connected only through a mounting surface attached to said power semiconductor package. |
地址 |
El Segundo CA US |