Molded insulator in package assembly

摘要

Embodiments of the present disclosure describe techniques and configurations for package assembly including an embedded element and a molded insulator material. In some embodiments, an apparatus includes an electrical element (such as a die or a bridge interconnect structure) positioned on a surface of an insulator layer, a conductive pad positioned on the surface of the insulator layer and spaced apart from the electrical element, and a molded insulator material disposed on the surface of the insulator layer adjacent to the electrical element and on the conductive pad. Other embodiments may be described and/or claimed.

主权项

1. An apparatus, comprising:
an insulator layer having a surface; an electrical element comprising a die or bridge interconnect structure positioned on the surface of the insulator layer, wherein the electrical element has a backside coupled to the surface of the insulator layer, wherein the backside is inactive; a conductive pad positioned on the surface of the insulator layer and spaced apart from the electrical element; and a molded insulator material disposed on the surface of the insulator layer adjacent to the electrical element and on the conductive pad such that the molded insulator material is in contact with the insulator layer and the conductive pad, wherein the molded insulator material has a surface flush with a top surface of the electrical element.