Wiring board and method for manufacturing same

摘要

A wiring board includes a core structure having a first surface and a second surface on the opposite side of the first surface, a first buildup structure formed on the first surface of the core structure and including insulation layers, and a second buildup structure formed on the second surface of the core structure and including insulation layers and an inductor device. The insulation layers in the second buildup structure have the thicknesses which are thinner than the thicknesses of the insulation layers in the first buildup structure, and the inductor device in the second buildup structure is position on the second surface of the core structure and includes at least a portion of a conductive pattern formed in the core structure.

主权项

1. A wiring board, comprising:
a core structure having a first surface and a second surface on an opposite side of the first surface; a first buildup structure formed on the first surface of the core structure and comprising a plurality of insulation layers; and a second buildup structure formed on the second surface of the core structure and comprising a plurality of insulation layers and an inductor device, wherein the insulation layers in the second buildup structure have thicknesses which are thinner than thicknesses of the insulation layers in the first buildup structure, and the inductor device in the second buildup structure is positioned on the second surface of the core structure and includes at least a portion of a first conductive pattern of the core structure, a plurality of conductive patterns formed on the insulation layers in the second buildup structure and a plurality of via conductors formed in the insulation layers in the second buildup structure such that the conductive patterns of the inductor device on different layers are connected by the via conductors.