| 摘要 |
An embodiment of the present invention provides a semiconductor package for millimeter wave. The semiconductor package for millimeter wave includes a first metal block, a second metal block, and a circuit board. The first metal block has a first penetration hole and a second penetration hole on the inside of a planarization layer. The second metal block has a first non-penetration hole and a second non-penetration hole on the inside of a planarization layer. The circuit board is arranged between the first and second metal blocks, and has a surface where a signal line for input and a signal line for output are formed. The first and second metal blocks comprises a first waveguide with first non-penetration hole and the first penetration hole, and a second waveguide with second non-penetration hole and the second penetration hole. |
