Semiconductor devices with multilayer flex interconnect structures

摘要

Semiconductor devices with multilayer flex interconnect structures. In some embodiments, a semiconductor device may include a semiconductor chip coupled to a planar substrate and a multilayer flex interconnect structure coupled to the semiconductor chip, the multilayer flex interconnect structure including at least: a first conductive layer, a second conductive layer, and a dielectric layer disposed between the first and second conductive layers. The semiconductor device may also include another semiconductor chip coupled to the planar substrate and placed in a side-by-side configuration with respect to the semiconductor chip, where the multilayer flex interconnect structure provides electrical connections between at least two terminals of the semiconductor chip and at least two terminals of the other semiconductor chip.

主权项

1. A semiconductor device, comprising:
a first semiconductor chip coupled to a planar substrate; a second semiconductor chip distinct from the first semiconductor chip and coupled to the same planar substrate in a side-by-side configuration with respect to the first semiconductor chip such that the first and second semiconductor chips are parallel with respect to each other and to the planar substrate; a multilayer flex interconnect structure coupled to the first and second semiconductor chips wherein the multilayer flex interconnect structure includes a flexible plastic material or film, wherein the multilayer flex interconnect structure further includes at least: a first conductive layer, a second conductive layer, and a dielectric layer disposed between the first and second conductive layers, and wherein the multilayer flex interconnect structure provides electrical connections between at least two terminals of the first semiconductor chip and at least two terminals of the second semiconductor chip; and a mold compound configured to encapsulate the first semiconductor chip and the second semiconductor chip, to surround at least two distinct outer surfaces of the multilayer flex interconnect structure such that the at least two distinct surfaces are horizontally disposed with respect to the first and second semiconductor chips to create a package in the form of a monolithic electronic component.