内连线结构及其制造方法;AN INTERCONNECTION STRUCTURE AND METHOD OF FORMING THE SAME

摘要

本揭露提供一种内连线结构及其制造方法。此内连线结构包含一导电插塞于一基材上；一导电元件于此导电插塞上，其中此导电元件具有一第一侧壁、一面对此第一侧壁之第二侧壁及一底面；以及一含碳阻障层，其具有一第一部分、一第二部分及一第三部分，此第一部分沿着此导电元件之此第一侧壁，此第二部分沿着此导电元件之此第二侧壁，此第三部分沿着此导电元件之此底面。; a conductive feature over the conductive plug, wherein the conductive feature has a first sidewall, a second sidewall facing the first sidewall, and a bottom surface; and a carbon-containing barrier layer having a first portion along the first sidewall of the conductive feature, a second portion along the second sidewall of the conductive feature, and a third portion along the bottom surface of the conductive feature.