| 发明名称 |
Input Device Haptics and Pressure Sensing |
| 摘要 |
Input device haptics and pressure sensing techniques are described. An input device includes an outer surface, a pressure sensor and haptic feedback mechanism, and a pressure sensing and haptic feedback module. The outer surface is configured to receive an application of pressure by an object. The pressure sensor and haptic feedback mechanism has one or more piezos configured to detect and quantify an amount of the application of the pressure to the outer surface by the object, the one or more piezos configured to output a signal indicating the quantified amount of the pressure. The pressure sensing and haptic feedback module is configured to receive the signal from the one or more piezos indicating the quantified amount of the pressure and control the haptic feedback of the pressure sensor and haptic feedback mechanism. |
| 申请公布号 |
US2015227207(A1) |
申请公布日期 |
2015.08.13 |
| 申请号 |
US201514698318 |
申请日期 |
2015.04.28 |
| 申请人 |
Microsoft Technology Licensing, LLC |
发明人 |
Winter Andrew E.;Cox Brian Rush;Ginn Launnie K. E.;Whitt, III David Otto;Fitz-Coy Aric A.;Picciotto Carl E.;Yun Gahn Gavyn;Nelson John Jacob |
| 分类号 |
G06F3/01;G06F3/041;G06F3/044 |
主分类号 |
G06F3/01 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An input device comprising:
an outer surface configured to receive an application of pressure by an object; a pressure sensor and haptic feedback mechanism having one or more piezos configured to detect and quantify an amount of the application of the pressure to the outer surface by the object, the one or more piezos configured to output a signal indicating the quantified amount of the pressure; and a pressure sensing and haptic feedback module configured to receive the signal from the one or more piezos indicating the quantified amount of the pressure and control the haptic feedback of the pressure sensor and haptic feedback mechanism by energizing the one or more piezos based at least in part of the quantified amount of pressure. |
| 地址 |
Redmond WA US |
