发明名称 |
RESISTIVE RANDOM ACCESS MEMORY |
摘要 |
A resistive random access memory including a first electrode, a dielectric layer, at least a first nanostructure and a second electrode is provided. The dielectric layer is disposed on the first electrode. The first nanostructure is disposed between the first electrode and the dielectric layer and includes a plurality of first cluster-type-type metal nanoparticles and a plurality of first covering-type metal nanoparticles. The first cluster-type-type metal nanoparticles are disposed on the first electrode. The first covering-type metal nanoparticles covers the first cluster-type-type metal nanoparticles, wherein a diffusion coefficient of the first cluster-type-type metal nanoparticles is larger than a diffusion coefficient of the first covering-type metal nanoparticles. The second electrode is disposed on the dielectric layer. |
申请公布号 |
US2015228895(A1) |
申请公布日期 |
2015.08.13 |
申请号 |
US201414267935 |
申请日期 |
2014.05.02 |
申请人 |
Powerchip Technology Corporation |
发明人 |
Chen Ching-Hua;Lin Chan-Ching |
分类号 |
H01L45/00 |
主分类号 |
H01L45/00 |
代理机构 |
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代理人 |
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主权项 |
1. A resistive random access memory, comprising:
a first electrode; a dielectric layer, disposed on the first electrode; at least a first nanostructure, disposed between the first electrode and the electrode layer, and the first nanostructure comprising:
a plurality of first cluster-type metal nanoparticles, disposed on the first electrode; anda plurality of first covering-type metal nanoparticles, covering the plurality of first cluster-type metal nanoparticles, wherein a diffusion coefficient of the plurality of first cluster-type metal nanoparticles is greater than a diffusion coefficient of the plurality of first covering-type metal nanoparticles; and a second electrode disposed on the dielectric layer. |
地址 |
Hsinchu TW |