发明名称 RESISTIVE RANDOM ACCESS MEMORY
摘要 A resistive random access memory including a first electrode, a dielectric layer, at least a first nanostructure and a second electrode is provided. The dielectric layer is disposed on the first electrode. The first nanostructure is disposed between the first electrode and the dielectric layer and includes a plurality of first cluster-type-type metal nanoparticles and a plurality of first covering-type metal nanoparticles. The first cluster-type-type metal nanoparticles are disposed on the first electrode. The first covering-type metal nanoparticles covers the first cluster-type-type metal nanoparticles, wherein a diffusion coefficient of the first cluster-type-type metal nanoparticles is larger than a diffusion coefficient of the first covering-type metal nanoparticles. The second electrode is disposed on the dielectric layer.
申请公布号 US2015228895(A1) 申请公布日期 2015.08.13
申请号 US201414267935 申请日期 2014.05.02
申请人 Powerchip Technology Corporation 发明人 Chen Ching-Hua;Lin Chan-Ching
分类号 H01L45/00 主分类号 H01L45/00
代理机构 代理人
主权项 1. A resistive random access memory, comprising: a first electrode; a dielectric layer, disposed on the first electrode; at least a first nanostructure, disposed between the first electrode and the electrode layer, and the first nanostructure comprising: a plurality of first cluster-type metal nanoparticles, disposed on the first electrode; anda plurality of first covering-type metal nanoparticles, covering the plurality of first cluster-type metal nanoparticles, wherein a diffusion coefficient of the plurality of first cluster-type metal nanoparticles is greater than a diffusion coefficient of the plurality of first covering-type metal nanoparticles; and a second electrode disposed on the dielectric layer.
地址 Hsinchu TW