AQUEOUS COPPER COLLOID CATALYST SOLUTION FOR ELECTROLESS COPPER PLATING AND ELECTROLESS COPPER PLATING METHOD

摘要

A non-conducting substrate is subjected to an adsorption-accelerating pretreatment by immersion in a surfactant-containing solution, whereafter an aqueous copper colloid catalyst solution for electroless copper plating which contains (A) a soluble copper salt, (B) a reducing agent and (C) a colloid stabilizer at a prescribed weight ratio of (A) and (C) and which is free from a surfactant or contains very little surfactant is applied to the non-conducting substrate and electroless copper plating is performed, thus ensuring that the catalyst solution has good stability over time. Subjecting the substrate to an adsorption-accelerating pretreatment to enhance the catalytic activity before applying the catalyst and performing electroless plating ensures that the deposited copper film exhibits excellent uniformity and little unevenness of deposition.