| 摘要 |
PROBLEM TO BE SOLVED: To at least maintain acceptable levels of total available on-chip capacitance while simultaneously shrinking the size of individual capacitors.SOLUTION: There is provided a manufacturing method including the steps of: providing a semiconductor chip; forming a first capacitor plate having a first hole, in the semiconductor chip; forming a capacitor dielectric having a second hole, in the first hole of the first capacitor plate; and forming a second capacitor plate in the second hole of the capacitor dielectric. |
