RELIABLE MICROSTRIP ROUTING FOR ELECTRONICS COMPONENTS

摘要

Reliable microstrip routing arrangements for electronics components are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon coupled to contact pads of an uppermost metallization layer of a semiconductor package substrate by a plurality of conductive contacts. A plurality of discrete metal planes is disposed at the uppermost metallization layer of the semiconductor package substrate, each metal plane located, from a plan view perspective, at a corner of a perimeter of the semiconductor die. Microstrip routing is disposed at the uppermost metallization layer of the semiconductor package substrate, from the plan view perspective, outside of the perimeter of the semiconductor die.

主权项

1. A semiconductor package, comprising:
first and second adjacent semiconductor dies; a silicon bridge structure electrically coupling the first and second semiconductor dies, and comprising a plurality of layers of conductive traces disposed above a substrate, a first pair of ground traces disposed in a first of the plurality of layers of conductive traces, a signal trace disposed in a second of the plurality of layers of conductive traces, below the first layer, and a second pair of ground traces disposed in a third of the plurality of layers of conductive traces, below the first layer; a plurality of package routing layers, wherein the silicon bridge structure is disposed in one of the package routing layers, the first and second die are disposed on the plurality of package routing layers, and the first die is electrically coupled to an uppermost metallization layer of the plurality of package routing layers by a plurality of conductive contacts; one or more discrete metal planes disposed at the uppermost metallization layer, each metal plane located, from a plan view perspective, at a corner of a perimeter of the first die; and microstrip routing disposed at the uppermost metallization layer, from the plan view perspective, outside of the perimeter of the first die.