ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, MASK BLANK PROVIDED WITH ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE FILM, PHOTOMASK, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE

摘要

Provided is an active light sensitive or radiation sensitive resin composition which contains an alkali-soluble resin (A) having a phenolic hydroxyl group and a crosslinking agent (C) that has two or more hydroxymethyl groups or alkoxymethyl groups in total in each molecule. This active light sensitive or radiation sensitive resin composition is characterized in that: a crosslinking agent (C1) that has a molecular weight of 420 or more and has 2-4 hydroxymethyl groups or alkoxymethyl groups in total in each molecule is contained in an amount of 60-100% by mole relative to the total amount of the crosslinking agent (C) including the crosslinking agent (C1); and the concentration of the total of the hydroxymethyl groups or the alkoxymethyl groups of the crosslinking agent (C) relative to 1 g of the solid content in the active light sensitive or radiation sensitive resin composition is 0.30 mmol/g or more.