| 发明名称 |
MEMS MICROPHONE |
| 摘要 |
Embodiments of the invention provide a micro electro mechanical systems (MEMS) microphone, which includes a microphone chip, a premold lead frame comprising a lead frame to which the microphone chip is electrically connected, and a cover coupled to the premold lead frame to cover the microphone chip and electrically connected to the premold lead frame. |
| 申请公布号 |
US2015230028(A1) |
申请公布日期 |
2015.08.13 |
| 申请号 |
US201414303799 |
申请日期 |
2014.06.13 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK Heung Woo;HAN Jong Woo;KIM Tae Hyun |
| 分类号 |
H04R23/00 |
主分类号 |
H04R23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A micro electro mechanical systems (MEMS) microphone, comprising:
a microphone chip; a premold lead frame comprising a lead frame to which the microphone chip is electrically connected; and a cover coupled to the premold lead frame to cover the microphone chip and electrically connected to the premold lead frame. |
| 地址 |
Gyeonggi-Do KR |
