DEVICE AND PROCESS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES
摘要
A spin chuck and a process of operating the same display improved resistance to backsplash by provision of a media collecting ring mounted on the spin chuck. The media collecting ring surrounds a wafer to be processed and includes a radially-inwardly extending upper portion having an obliquely-angled downwardly-facing surface positioned above an upper surface of a wafer held in the device. The device moreover includes a stationary chamber surrounding the spin chuck equipped with at least two superposed collecting baffles. During treatment, liquid collected by the media collecting ring is preferably discharged radially outwardly through a series of holes formed in the ring, so as to pass between a pair of the superposed collecting baffles of the chamber.
申请公布号
WO2012156858(A3)
申请公布日期
2015.08.13
申请号
WO2012IB52239
申请日期
2012.05.04
申请人
LAM RESEARCH AG;LAM RESEARCH CORPORATION;PUGGL, MICHAEL;AUFEGGER, CHRISTIAN;HOHENWARTER, KARL-HEINZ