发明名称 ABRASIVE PARTICLE, MANUFACTURING METHOD OF THE SAME, POLISHING METHOD, POLISHING DEVICE, AND SLURRY
摘要 [Problem] To polish the surface of an object material at a high removal rate and into a high-quality surface. [Solution] The object material is polished by wet polishing. A slurry comprises polishing abrasive particles dispersed in pure water. Each of the polishing abrasive particles comprises a component that exerts a mechanochemical action, a component that reacts to a frictional heat generated when polishing the object material, and the like, integrated into a particle as a whole. The components are bonded directly to one another by mechanical alloying while each retains the inherent properties of the substances in the individual component. Using this slurry in a lapping process for sapphire, silicon carbide, gallium nitride, and the like, allows the polishing time to be much shorter than conventionally, and allows the processing costs to be reduced significantly. The quality of the polished surface is high. The polishing abrasive particle can be used repeatedly for polishing. As the pH of the slurry is on the order of 3 to 9, there is no impact on the environment of the polishing work area, and processing of liquid waste is simple.
申请公布号 CA2936498(A1) 申请公布日期 2015.08.13
申请号 CA20152936498 申请日期 2015.01.19
申请人 ASAHI KASEI KOGYO CO., LTD. 发明人 FUJIMOTO, SHUNICHI;YAMASHITA, TETSUJI
分类号 C09K3/14;B24B1/00;B24B37/00;C09G1/02;H01L21/304 主分类号 C09K3/14
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