发明名称 WIRE FIXING STRUCTURE USING BINDING BAND
摘要 PROBLEM TO BE SOLVED: To provide a technique for reducing a slack by absorbing the size tolerance, that has increased on one side for a binding band, even after fixing a wire with the binding band.SOLUTION: A wire fixing structure 10 using a binding band includes a fixing member 20 having a wire fixing portion 24 where a first band insertion hole 30 and a second band insertion hole 40 are formed, a wire 12, and a binding band 50 including a band 52 and a band fixing portion 56 capable of locking the bands 52, 52, and locked to a band fixing portion 56 in a state where the band 52 is passed through a first band insertion hole 30 and a second band insertion hole 40, and wound around the wire 12 and the wire fixing portion 24. Since the first band insertion hole 30 is formed arcuate shape extending around the second band insertion hole 40, the binding band 50 and wire 12 are provided rotatably about the second band insertion hole 40, for the fixing member 20.
申请公布号 JP2015146685(A) 申请公布日期 2015.08.13
申请号 JP20140018516 申请日期 2014.02.03
申请人 SUMITOMO WIRING SYST LTD 发明人 TAKADA KAZUNORI
分类号 H02G3/30;B60R16/02;F16B2/08;F16B5/12 主分类号 H02G3/30
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