| 摘要 |
<p>The present specification provides a semiconductor package, a semiconductor lead frame, and a method for manufacturing the semiconductor package. Three floating leads which are separated from one side of a device mounting plate mounting a power semiconductor device with three electrodes with a preset distance are applied to the semiconductor package. For this, the semiconductor package according to one embodiment of the present invention includes: the device mounting plate which is for mounting the power semiconductor device with the three electrodes; three floating leads which are electrically connected to the three electrode through a bonding wire, respectively, and are separated from one side of the device mounting plate with a preset distance; and a sealing resin which seals the device mounting plate and a part of the three floating leads.</p> |
