| 摘要 |
<p>The invention provides a curable resin composition which can improve thickness uniformity and linewidth uniformity of film formation of a resist and adhesiveness of the resist film at developing while the solubility and stability of preparation of the resist composition is increased, and safety is improves as well. The curable resin composition comprises multipolymer and a solvent, wherein the multipolymer comprises (A) monomer unit corresponding to polymerizable unsaturated compound containing alicyclic epoxy group and (B) monomer unit containing alkali-soluble group, and the solvent contains dipropylene glycol dimethyl ether accounting for 30 to 100 % by mass of the total solvent.</p> |
