<p>Tin electroplating baths having certain brightening agents and nonionic surfactants provide tin-containing solder deposits having good morphology, reduced void formation and improved within-die uniformity.</p>
申请公布号
EP2868778(A3)
申请公布日期
2015.08.12
申请号
EP20140191883
申请日期
2014.11.05
申请人
ROHM AND HAAS ELECTRONIC MATERIALS LLC
发明人
WOERTINK, JULIA;QIN, YI;PRANGE, JONATHAN D.;LOPEZ MONTESINOS, PEDRO O.
