| 摘要 |
The array board 11b includes a first diode 29, a common line 25, a first shorting line 31, and the static protection portion 51. The first diode 29 include at least the first semiconductor portion 29d having outer edges 29d1 that cross the outer edges 29a1, 29b1 of first electrodes 29a, 29b in a plan view. The common line 25 is formed from the first metal film 34. The first shorting line 31 is formed from the second metal film 38 and crosses the common line 25. The static protection portion 51 is formed from the second metal film 38 or the protection film 37. At least a portion of the static protection portion 51 overlaps the common line 25 in a plan view. The static protection portion 51 is arranged closer to the first diode 29 than an intersection CPT of the common line 25 and the first shorting line 31. The static protection portion 51 includes at least a static dissipating portion 52 for dissipating static. |
