发明名称 POLISHING COMPOSITION
摘要 <p>A polishing composition of the present invention is to be used for polishing an object including a metal portion or an interlayer insulation film. The polishing composition contains silica on which an organic acid, such as a sulfonic acid and a carboxylic acid, is immobilized and an oxidizing agent.</p>
申请公布号 EP2800124(A4) 申请公布日期 2015.08.12
申请号 EP20120862165 申请日期 2012.12.25
申请人 FUJIMI INCORPORATED 发明人 YOKOTA, SHUUGO;KACHI, YOSHIHIRO;AKATSUKA, TOMOHIKO
分类号 H01L21/304;B24B37/00;C09K3/14;H01L21/02;H01L31/05 主分类号 H01L21/304
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