Method for producing at least one optoelectronic semiconductor component

摘要

A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.

主权项

1. A method of producing at least one optoelectronic semiconductor component comprising:
a) providing a carrier having a top side, an underside situated opposite the top side of the carrier, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; b) applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side of the carrier, said components each having at least one contact area facing away from the carrier; c) applying protective elements to the contact areas and the connection areas; d) applying at least one electrically insulating layer to exposed locations of the carrier, of the contact areas and of the protective elements; e) producing openings in the electrically insulating layer by removing the protective elements; and f) arranging electrically conductive material on the electrically insulating layer and at least in places in the openings, wherein the electrically conductive material electrically conductively connects a contact area to the connection area assigned thereto, wherein, before step d), a protective layer is applied to a radiation passage area of an optoelectronic component which covers the radiation passage area at least in places, and the protective layer is removed after step d) as a result of which a window is produced in the electrically insulating layer.