发明名称 Method of forming shallow trench isolation structure
摘要 A method of forming a shallow trench isolation structure is disclosed. Hard mask patterns are formed on a substrate. A portion of the substrate is removed, using the hard mask patterns as a mask, to form first trenches in the substrate, wherein a fin is disposed between the neighboring first trenches. A filling layer is formed in the first trenches. A patterned mask layer is formed on the filling layer. A portion of the filling layer and a portion of the fins are removed, using the patterned mask layer as a mask, to form second trenches in the substrate. A first insulating layer is formed on the substrate filling in the second trenches.
申请公布号 US9105685(B2) 申请公布日期 2015.08.11
申请号 US201313941208 申请日期 2013.07.12
申请人 United Microelectronics Corp. 发明人 Lin Chien-Ting;Tsai Shih-Hung;Lin Chun-Hsien
分类号 H01L21/762;H01L21/308;H01L21/8238;H01L21/84;H01L21/8234 主分类号 H01L21/762
代理机构 J.C. Patents 代理人 J.C. Patents
主权项 1. A method of forming a shallow trench isolation structure, comprising: forming a plurality of hard mask patterns on a substrate; removing a portion of the substrate by using the hard mask patterns as a mask, so as to form a plurality of first trenches in the substrate, wherein a fin is disposed between the neighboring first trenches; forming a filling layer in the first trenches; forming a patterned mask layer on the filling layer; removing a portion of the filling layer, and a portion of the fins by using the patterned mask layer as a mask, so as to form a plurality of second trenches in the substrate, wherein the step of removing the portion of the filling layer and the portion of the fins further comprises breaking loops of the fins; and forming a first insulating layer on the substrate filling in the second trenches.
地址 Hsinchu TW