发明名称 |
Fin field effect transistor gate oxide |
摘要 |
The present disclosure provides for methods of fabricating a semiconductor device and such a device. A method includes providing a substrate including at least two isolation features, forming a fin substrate above the substrate and between the at least two isolation features, forming a silicon liner over the fin substrate, and oxidizing the silicon liner to form a silicon oxide liner over the fin substrate. |
申请公布号 |
US9105661(B2) |
申请公布日期 |
2015.08.11 |
申请号 |
US201113288407 |
申请日期 |
2011.11.03 |
申请人 |
Taiwan Semconductor Manufacturing Company, Ltd. |
发明人 |
Huang Gin-Chen;Chen Neng-Kuo;Wann Hsingjen |
分类号 |
H01L21/00;H01L29/66;H01L29/78 |
主分类号 |
H01L21/00 |
代理机构 |
Haynes and Boone, LLP |
代理人 |
Haynes and Boone, LLP |
主权项 |
1. A method of fabricating a semiconductor device, the method comprising:
providing a substrate including at least two isolation features; forming a fin extending above the substrate and between the at least two isolation features, wherein the fin has a top surface two opposing sidewalls, and a first width; depositing an amorphous silicon layer over the fin including on the top surface and the two opposing sidewalls; oxidizing the amorphous silicon layer to concurrently form a silicon oxide layer directly on the top surface and the sidewall surfaces of the fin, wherein the fin has the first width after the oxidizing the amorphous silicon layer; and forming a gate electrode on the concurrently formed silicon oxide layer that is disposed on the top and sidewall surfaces of the fin, wherein the fin having the first width forms a channel of the semiconductor device having a gate structure on the fin including the gate electrode and a gate dielectric layer of the formed silicon oxide layer. |
地址 |
Hsin-Chu TW |