Method of coating surface of substrate hole with layer of reduced graphene oxide

摘要

A method for coating a layer of reduced graphene oxide (rGO) on the surface of substrate holes (especially holes with high aspect ratio) includes a serial wet process steps of hydrophilic treatment of the surface of the substrate, self-assembly of a silane layer, steps of grafting of a polymer layer, grafting of graphene oxide (GO), intercalation of metal ions, and intercalation of metal atom/rGO intercalation. The method further includes the decoration of conductive metals (copper or nickel tungsten) plug on the rGO layer in holes by electroplating process.

主权项

1. A method for coating a layer of reduced graphene oxide on the surface of holes in a substrate, comprising:
Step 1 (surface hydrophilic treatment) washing the substrate with alcohol, immersing the substrate in a mixed solution of concentrated sulfuric acid and concentrated hydrogen peroxide, and removing organic remains on the substrate, to offer the surfaces of the substrate and holes carrying —OH groups; Step 2 (self-assembly of a silane layer) immersing the treated substrate from Step 1 in a silane solution to form a self-assembly silane layer on the surface of the substrate and the holes; Step 3 (grafting of a polymer layer) immersing the treated substrate from Step 2 in a polymer solution to form a polymer layer on the self-assembly silane layer; Step 4 (grafting of a graphene oxide (GO) layer) immersing the treated substrate from Step 3 in an alkaline GO solution to graft a GO layer on the polymer layer; Step 5 (intercalation of metal ions) immersing the treated substrate from Step 4 in a solution of metal ion to intercalate the metal ions into the GO layer, and form a metal ion/GO abrasion; and Step 6 (formation of a metal atom/rGO composite layer) immersing the treated substrate from Step 5 in a solution of reductant to reduce the metal ion into metal atom, and the GO layer into a reduced graphene oxide (rGO) layer to form a metal atom/rGO composite layer on the substrate surface and the hole surface.