Profile control in interconnect structures

摘要

The profile of a via can be controlled by forming a profile control liner within each via opening that is formed into a dielectric material prior to forming a line opening within the dielectric material. The presence of the profile control liner within each via opening during the formation of the line opening prevents rounding of the corners of a dielectric material portion that is present beneath the line opening and adjacent the via opening.

主权项

1. An interconnect structure comprising:
a dielectric material comprising a via opening and a line opening, wherein said line opening is located above and connected to said via opening; a profile control liner present at least partially on sidewalls of said dielectric material within said via opening; a diffusion barrier liner located within said via opening and said line opening; and a conductive material located within remaining portions of said via opening and said line opening, wherein a portion of said conductive material within at least one portion of said via opening is separated from said dielectric material by a portion of said profile control liner and a portion of said diffusion barrier liner, and wherein another portion of said conductive material within a lower portion of said via opening is separated from said dielectric material by only another portion of said diffusion barrier liner.