Voids in interconnect structures and methods for forming the same

摘要

A device includes a dielectric layer, a passive device including a portion in the dielectric layer, and a plurality of voids in the dielectric layer and encircling the passive device.

主权项

1. A device comprising:
a dielectric layer; a passive device comprising a portion in the dielectric layer, wherein the passive device comprises a Metal-Oxide-Metal (MOM) capacitor, a resistor, an inductor, a transformer, a balun, a micro-stripe, or a co-planar waveguide; a plurality of voids in the dielectric layer and encircling the passive device; a plurality of low-k dielectric layers overlying the dielectric layer; and a non-low-k dielectric layer over the plurality of low-k dielectric layers, wherein additional voids are formed in the plurality of low-k dielectric layers and surrounding the passive device.